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システム |
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CPU |
RAC-1100-R32 : 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU
RAC-1100-R64 : 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU
RAC-1100-IND : 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU
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GPU |
RAC-1100-R32 : 1792-core NVIDIA Ampere™ architecture GPU with 56 Tensor Cores
RAC-1100-R64 : 2048-core NVIDIA Ampere™ architecture GPU with 64 Tensor Cores
RAC-1100-IND : 2048-core NVIDIA Ampere™ architecture GPU with 64 Tensor Cores
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DLアクセラレータ |
2x NVDLA Engines |
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メモリ |
RAC-1100-R32 : 1 32GB LPDDR5 DRAM
RAC-1100-R64 : 1 64GB LPDDR5 DRAM
RAC-1100-IND : 1 64GB LPDDR5 DRAM |
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OS |
- Linux
- NVIDIA JetPack SDK
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I/Oインタフェース |
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USB |
2 USB 3.1 (M12) |
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シリアルポート |
2 COM RS-232/422/485 (M12 A-coded) |
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LAN |
2 GigE LAN (M12 X-coded) |
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HDMI |
1 HDMI 2.1 (M12) |
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CAN Bus |
2 Isolated CAN Bus support CAN FD (M12 A-coded) |
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フラッシュ |
1 Micro USB OS flash port |
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ボタン |
1 Power Button with LED, 1 Recovery button |
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拡張スロット |
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M.2 |
- 1 M.2 Key B Socket (3042/3052)
- 1 M.2 Key E Socket (2230)
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グラフィックス |
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インタフェース |
1 Digital Display, up to 4K60 |
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動画エンコード |
- HEVC: 2x 4K @60, 4x 4K @30, 8x 1080p @60, 16x 1080p @30
- H.264: 1x 4K @60, 3 X4k @30, 7x 1080p @60, 14x 1080p @30
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動画デコード |
- HEVC: Up to 1x 8K @30, 3x 4K @60, 7x 4K @30, 11x 1080p @60, 22x 1080p @30
- H.264: Up to 1x 4K @60, 3x 4K @30, 6x 1080p @60, 13x 1080p @30
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ストレージ |
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M.2 |
2 M.2 Key M Socket (2280) |
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eMMC |
1 eMMC 5.1, 64GB |
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イーサネット |
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LAN 1 |
10/100/1000 Base-T Ethernet GigE LAN, X-coded M12 Connector |
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LAN 2 |
10/100/1000 Base-T Ethernet GigE LAN, X-coded M12 Connector |
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PoE+ |
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LAN 3 |
IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, X-coded M12 Connector |
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LAN 4 |
IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, X-coded M12 Connector |
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LAN 5 |
IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, X-coded M12 Connector |
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LAN 6 |
IEEE 802.3at (25.5W/48V) GigE PoE+ LAN, X-coded M12 Connector |
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Total PoE power budget support up to 60W at 25°C, 30W at 70°C |
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電源 |
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入力電圧 |
DC 9V to 50V |
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インタフェース |
4-pin K-Code M12 connector |
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メカニカル設計 |
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外形寸法 |
260 mm x 330 mm x 80 mm (10.23" x 13" x 3.14") |
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質量 |
7 kg (15.43 lb) |
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マウント |
Wallmount |
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設置環境条件 |
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動作温度 |
30W TDP Mode : -25°C to 70°C (-13°F to 158°F), with 0.63 m/s air flow
40/50W TDP Mode : -25°C to 55°C (-13°F to 131°F), with 0.63 m/s air flow
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保存温度 |
-40°C to 85°C (-40°F to 185°F) |
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湿度 |
5% to 95% Humidity, non-condensing |
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相対湿度 |
95% @ 70°C |
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耐衝撃性 |
Operating, MIL-STD-810G, Method 516.7, Procedure I |
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耐振動性 |
Operating, MIL-STD-810G, Method 514.6, Procedure I, Category 4 |
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EMC指令 |
CE, FCC, EN50155, EN50121-3-2, IP67 |