TaiNEX 1 | Booth #K0816 (Ennoconn's booth)
TWTC | Booth #A0618 (Joint showcase)

Date: May 27 (Tue) – 28 (Wed), 2026
Venue: Boston Convention and Exhibition Center
Booth No.: #323

Vecow ECX-4000, TGS-1000, VCM-2000, and TGS-2000 industrial edge AI platforms have successfully achieved Intel® Edge System Qualification and are listed as Intel® AI Edge Systems, enabling Workload-Based Platform Selection for Faster and More Reliable Edge AI Deployment

Freeing engineering teams from complex firmware porting, Vecow joins the Arm ecosystem to offer frictionless, generic OS compatibility.

Japan IT Week Spring 2026 | April 8–10 | Vecow's Booth: West Hall 3 & 4, W23-43
Come to see Vecow's latest AI edge solutions through live demos. From platform architecture to deployment readiness, Vecow's unwavering technological capabilities turn the ideals of robotics into reality.

Empowering Edge AI with the World’s First Stackable PC Powered by Intel® Core™ Ultra Series 3 Processors, features advanced CPU+GPU+NPU hybrid architecture supporting max 100 TOPS for Edge and Physical AI

New P-core exclusive architecture delivers deterministic performance and seamless drop-in upgrades for mission-critical AIoT and edge data centers.

Empowering Humanoid Robotics and AI AMR Upgrades through Integrated Edge AI Platforms and Strategic Industry Collaboration

This strategic alliance harmonizes performance-driven rugged Edge AI hardware with intelligent software agility to deliver unparalleled reliability for mission-critical global safety and security infrastructure.

Delivering on the SPC Series promise of "Right Performance at Every Edge" with efficient AI, TSN, and 5G connectivity.