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システム |
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プロセッサ |
- 24-core Intel® Core™ 200S Series Processor (Bartlett Lake-S)
- 24-core Intel® Core™ i9/i7/i5/i3 Processor (14th gen, Raptor Lake-S Refresh)
- 24-core 13th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S)
- 16-core 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S)
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チップセット |
Intel® R680E |
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GPU |
Intel® UHD Graphics 770/730 |
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BIOS |
AMI |
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SIO |
IT8786E |
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メモリ |
2 DDR4 3200MHz SO-DIMM, up to 64GB (ECC/Non-ECC) |
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OS |
Windows 11, Windows 10, Linux |
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I/Oインタフェース (D38999コネクタ採用) |
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シリアル |
4 COM RS-232/422/485 |
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USB |
6 USB 2.0 |
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ディスプレイ |
DVI-I : Up to 1920 x 1080 @60Hz |
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拡張スロット |
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Mini PCIe |
1 Mini PCIe Socket for PCIe/USB/SIM Card/Optional mSATA
**Optional customization by request
5G Module, 4G Module, WiFi & Bluetooth
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M.2 |
- 1 M.2 Key B Socket (3042/3052, SATA/USB 3, default/USB 2)
- 1 M.2 Key E Socket (2230, PCIe x2/USB)
**Optional customization by request
5G Module, 4G Module, WiFi & Bluetooth
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ストレージ |
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SATA |
2 SATA III (6Gbps) support software RAID 0, 1 |
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mSATA |
1 SATA III (Mini PCIe Type, 6Gbps) |
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M.2 |
1 M.2 Key M Socket (2280, PCIe x4) |
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その他 |
2 Front-access 2.5" SSD/HDD Tray |
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オーディオ |
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コーデック |
Realtek® ALC888S-VD, 7.1 Channel HD Audio |
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端子 |
1 Mic-in, 1 Line-out |
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イーサーネット |
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LAN 1 |
Intel® I219LM GigE LAN supports iAMT |
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LAN 2 |
Intel® I226 2.5GigE LAN supports TSN |
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LAN 3 |
Intel® I226 2.5GigE LAN supports TSN |
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LAN 4 |
Intel® I226 2.5GigE LAN supports TSN |
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電源 |
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入力電圧 |
DC 9V to 50V, AT mode |
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インタフェース |
4-pin MIL-DTL-38999 Connector |
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その他 |
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TPM |
Infineon SLB9670 supports TPM 2.0, SPI Interface |
ウォッチドッグ
タイマ (WDT) |
Reset : 1 to 255 sec./min. per step |
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HW Monitor |
Monitoring temperature, voltages. Auto throttling control when CPU overheats. |
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メカニカル設計 |
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外形寸法 |
275.0mm x 376.0mm x 130.0mm (10.82" x 14.8" x 5.11") |
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質量 |
15.2 kg (33.5 lb) |
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マウント |
Wallmount by mounting bracket |
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設置環境条件 |
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動作温度 |
-40°C to 65°C (-40°F to 149°F) with air flow |
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保存温度 |
-55°C to 85°C (-67°F to 185°F) |
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湿度 |
5% to 95% Humidity, non-condensing |
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相対湿度 |
95% @65°C |
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低気圧(高度) |
MIL-STD-810G method 500.5, Procedure II |
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高温 |
MIL-STD-810G method 501.5, Procedure II |
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低温 |
MIL-STD-810G method 502.5, Procedure II |
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耐衝撃性 |
MIL-STD-810G method 514.6, Category 24 |
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耐振動性 |
MIL-STD-810G method 516.6, Procedure I |
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EMC指令 |
CE, FCC, MIL-STD-461G |